Low Temperature Silver Solder Paste

Solder it silver bearing solder paste in easy to use no mess no waste syringe.

Low temperature silver solder paste.

These low peak temperatures allow for soldering of thermally sensitive assemblies. The kb 430 low temperature silver paste solder has a non tarnishing white color that is ideal for repairing or creating white base metal jewelry. Combination with lead tin solder may dramatically lower melting point and lead to joint failure. Low melting point flows smoothly at 430 f.

Ready to use flux is blended in just add heat. The peak reflow temperatures provided by tin bismuth alloys are low 160 170 c as compared to tin lead solders 210 220 c. Tin bismuth and tin bismuth silver are the most common choices for low melting lead free solder pastes. Snbi paste sac solder ball low temp bisnag paste before reflow after reflow bismuth diffused region un melted sac solder ball package board low temp solder lts board bisn 57 42 ag x 0 4 1 snagcu 96 5 3 0 5 snagcu 95 5 4 0 5 in use today for consumer tvs white goods led products sac alloys eutectic tin lead alloy snpb 63 37.

Silver solder paste low temperature this non tarnishing product works on nickel silver tin white bronze stainless steel brass and bronze. Because of the low silver content we do not recommend using this product on silver items specifically for production as it will dilute the silver content. Soldering made easy the skill is in the paste. 455 silver solder paste 10grm syringe lowest melting point general purpose alloy a free flowing silver solder with excellent capillary properities.

Use this solder on nickel nickel alloy german silver tin white bronze stainless steel brass and bronze. Solder paste sn42 bi57 6 ag0 4 no clean lead free low temperature melts 138c 281f maiyum 63 37 tin lead rosin core solder wire for electrical soldering 0 8mm 50g 1 best seller. Low temperature eutectic solder with high strength. Particularly strong very brittle.

Made from premium refined powdered metals. Used extensively in through hole technology assemblies in ibm mainframe computers where low soldering temperature was required. Produces small neat fillets and high strength leak free joints.